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F11X-Wafer Bonding Process Development Engineer

Company: Jobleads
Location: Albuquerque
Posted on: May 3, 2021

Job Description:

" F11XWafer Bonding Process Development Engineer Job ID: JR0150913 Job Category: Engineering Primary Location: Albuquerque, NM US Other Locations: Job Type: Experienced Hire F11X-Wafer Bonding Process Development EngineerJob DescriptionProcess Development Engineers (PDE) are responsible for leading process development research enabling manufacture of innovative device architectures coupled with the realization of these architectures. The PDEs design, execute, and analyze experiments necessary to meet engineering specifications for their process. They participate in development of intellectual property and develop the equipment necessary to exploit the understanding gained in research (in collaboration with equipment suppliers). The PDEs work effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues. The PDEs work to gain in-depth knowledge of their materials, process, and equipment to meet quality, reliability, cost, yields, and product development timelines.The ideal candidate should exhibit the following behavioral traits:Excellent verbal and written communication skillsAbility to work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.QualificationsMinimum Qualifications:You must possess a minimum of a Ph.D. degree majoring in Physics, Material Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering.3+ years of experimental thesis work in the completion of the degree.3+ years of experience in Silicon Wafer Bonding and bonding quality characterization.Additional Qualifications:Experience with bonding and material characterization techniques: XRD, photoluminescence, SEM.Experience with bonding dissimilar material system, managing thermomechanical differences, and reducing impact of various stresses.Experience with building analytical models and simulation using ANSYS, ABAQUS, or similar software to reduce experiment cost and increase knowledge of process behavior.Inside this Business GroupAs the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on EarthPosting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Keywords: Jobleads, Albuquerque , F11X-Wafer Bonding Process Development Engineer, Other , Albuquerque, New Mexico

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